BEEYUIHF Lead Free Solder Paste with flux Low Temp Sn42 Bi58 (1.05oz/30g)

Description: BEEYUIHF Lead Free Solder Paste, 138 Low Temp Solder Paste, Sn42 Bi58 Solder Flux, Tin Cream, welding Flux, For LED PCB,solder paste,solder flux paste,138 solder paste,low temp solder paste,Lead-free solder paste,smd solder paste,welding paste,solder paste flux,138 degrees soldering tin,paste flux,soldering paste,no-clean solder paste,paste,welding tin (1.05oz/30g) Sn42 Bi58 Solder Paste：Low temperature Solder Paste, melting point: 138°C (280F). Technical Parameters: Product composition: Sn:42%, Bi:58%.Model: BEEYUIHF solder tin pasteGross weight: 1.05oz/30g syringeMelting Point: 138°C (280F) Particle size: #3 (25-45 microns) Storage temperature: 0-10℃wettability: Bright and uniform solder joints.Printability: eliminates missing pits and lumps during printingProperty: reflow does not create tin beads and tin bridgesLifetime: Can print continuously for more than ten hours at room temperature without producing tin beadsApplication: welding of radiator modules & LED welding & high frequency welding & PCB BGA CPU SMD Rework Tools Melting point 138℃ solder paste: 1、Excellent printability, eliminating the omission of depression and knot fast phenomenon in the printing process2、Good wettability, bright and even full solder joints3、without tin beads and tin bridges when soldering back4, long-term paste life, long stencil printing life5, suitable for wider process and fast printing6、Low temperature solder paste is mainly used for heat sink module welding, LED welding, high frequency welding, etc. Application range of low temperature solder paste: Melting point of 138 ℃ solder paste is called low temperature solder paste, when the SMD components can not withstand the temperature of 200 ℃ and above and the need for SMD reflow process, the use of low temperature solder paste for soldering process. Up to protect can not withstand high temperature reflow soldering original and PCB, especially suitable for LED, its alloy composition is tin-bismuth alloy. Low-temperature solder paste reflow soldering peak temperature at 170-200 ℃. what is the solder paste?Tin paste is the liquid after the melting of tin bar. Tin paste refers to the slurry produced by grinding metal tin into a very fine powder and adding flux. It is also called tin slurry. In general, it is most commonly used in wave soldering machines, reflow soldering machines, tin furnaces, etc. 138°C (280F) Melting PointLow temperature tin is often used for the maintenance of electronic products. The melting point of Low Temperature Tin is 138 degrees Celsius, the particle size of tin powder is between 25 and 45 microns. Low temperature tin is mainly used for elements that can not withstand high temperature device.

Price: 10.39 USD

Location: Walnut, California

End Time: 2024-09-29T08:14:25.000Z

Shipping Cost: 0 USD